The next sample build of the Herkules II v3 is now ongoing:
Main improvements are:
- Additional MOLEX connector fitting to FlightControl ME2.1: There are now no solderjoints on the FlightControl necessary any more because the 5-pin Molex cable can be connected easily.
- Improved soldering of Electrolytic caps: Each ElCap has now thermals which improves the soldering.
- Improved short cut protection by solderjoints: All vias on the pcb are now filled and galvanised so there is no danger of having short cut when soldering motor wires or plugs.
- Improved solder mask: Quality of solder mask was improved. No dissolution of soldermask by to much heat possible.
Verbesserter Lötstopplack: Die Qualität des Lötstopplackes wurde wesentlich verbessert so dass ein ablösen durch zu viel Hitze beim Löten vermieden wird.
The new Herkules II v3 ESC boards will be available in 22. September. So please be a bit patient....
